Télécharger le livre :  Handbook of Wafer Bonding

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team...
Editeur : Wiley-VCH
Parution : 2011-05-18

Format(s) : PDF, ePub
190,90